Impact of Big Data on Inspections for Semiconductors

Authors: Wei Lin Y and Hsu C*

DOI: 10.23880/nnoa-16000211

Volume 6, Issue 2

Abstract

This paper mainly illustrates the impact of big data on pattern and wafer inspections for semiconductor. First of all, how to making mask and wafer are displayed briefly included the front-end processes and the back-end processes. The reluctant defects for pattern generation and wafer inspection are briefly explained. Following the inspection methods handle with new issues are introduced. Finally, the impacts of big data on the pattern and wafer are demonstrated.

Keywords: Mask Inspection; Wafer Inspection; Die-To-Die; Die-To-Database; Big Data

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