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Tingyu Su

Tingyu Su

Editorial Board Member
Massachusetts Institute of Technology USA Member since 2024

Biography

Tingyu Su is a R&D packaging engineer at Intel. He holds B.S. from University of Science and Technology of China (USTC) in Applied Physics and received a Ph.D. in materials science from Massachusetts Institute of Technology in 2024. He has been working on many areas of Materials Science including the growth and processing of oxide nanocomposite thin films, FIB-STEM characterization and COMSOL finite-element modelling of micro-magnetics.

Research Interests

Design Growth Characterization and Modelling of Multiferroic Oxide Nanocomposites Thin Films

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